Compared to conventional PCB glass fiber, glass substrate glass fiber requires higher flatness and lower dielectric properties, so I think Nittobo’s ASP will rise further.
So you think this should be positive for Nittobo? After reading your article I thought this might be negative for Nittobo, because you say "this is clearly a negative for glass substrates."
So if your prediction is correct and glass substrates will be adopted by Intel/Apple/Samsung for CPUs and mobile processors, this would provide a massive upside for Nittobo, because the volumes are so high (even higher than AI accelerators), right?
Nice article, thx! How would this affect companies like Nittobo?
What are the timelines here in your opinion?
Compared to conventional PCB glass fiber, glass substrate glass fiber requires higher flatness and lower dielectric properties, so I think Nittobo’s ASP will rise further.
Perhaps around 2027–2028?
So you think this should be positive for Nittobo? After reading your article I thought this might be negative for Nittobo, because you say "this is clearly a negative for glass substrates."
What am I not getting here?
No, what I mean is that this could be positive for Nitobo.
That is, if the SiC interposer fails.
At this point, nobody knows whether the SiC interposer will succeed or the glass substrate will succeed.
Ok, got it.
So if your prediction is correct and glass substrates will be adopted by Intel/Apple/Samsung for CPUs and mobile processors, this would provide a massive upside for Nittobo, because the volumes are so high (even higher than AI accelerators), right?
yup